D/A AREA MATERIAL

Russian translation: материал в месте присоединения кристалла

GLOSSARY ENTRY (DERIVED FROM QUESTION BELOW)
English term or phrase:D/A AREA MATERIAL
Russian translation:материал в месте присоединения кристалла
Entered by: Dmitrey

20:10 Jul 21, 2019
English to Russian translations [PRO]
Tech/Engineering - Electronics / Elect Eng / PCB, packaging
English term or phrase: D/A AREA MATERIAL
Здравствуйте, коллеги!

Вот страница из китайской брошюры по корпусированию СВЧ элементов.

http://prntscr.com/oi4gm2

Скажите, что такое может быть "D/A AREA MATERIAL" (выделено зеленым в таблице) ?
Всем откликнувшимся заранее благодарен)
Dmitrey
Russian Federation
Local time: 11:40
материал в месте присоединения кристалла
Explanation:
die attach area = место присоединения кристалла (к основанию корпуса)

Особенности процесса сборки, Присоединение кристалла к ...
https://studexpo.ru/67963/elektrotehnika/osobennosti_protses...
Присоединение кристалла к основанию корпуса ...

--------------------------------------------------
Note added at 53 mins (2019-07-21 21:04:29 GMT)
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Этот материал должен обладать высокой теплопроводностью

https://www.multitran.com/m.exe?l1=1&l2=2&s=die attach area
die attach area
эл. место присоединения кристалла

Die Attach Process
https://eesemi.com/dieattach.htm
Fig. 2. Photo showing the D/A adhesive as the grainy material between the die and the die pad
...
Die Attach (also known as Die Mount or Die Bond) is the process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package. There are two common die attach processes, i.e., adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and die attach tools to mount the die.
Selected response from:

mk_lab
Ukraine
Local time: 10:40
Grading comment
Спасибо большое!
4 KudoZ points were awarded for this answer



Summary of answers provided
3 +1материал в месте присоединения кристалла
mk_lab


  

Answers


45 mins   confidence: Answerer confidence 3/5Answerer confidence 3/5 peer agreement (net): +1
d/a area material
материал в месте присоединения кристалла


Explanation:
die attach area = место присоединения кристалла (к основанию корпуса)

Особенности процесса сборки, Присоединение кристалла к ...
https://studexpo.ru/67963/elektrotehnika/osobennosti_protses...
Присоединение кристалла к основанию корпуса ...

--------------------------------------------------
Note added at 53 mins (2019-07-21 21:04:29 GMT)
--------------------------------------------------

Этот материал должен обладать высокой теплопроводностью

https://www.multitran.com/m.exe?l1=1&l2=2&s=die attach area
die attach area
эл. место присоединения кристалла

Die Attach Process
https://eesemi.com/dieattach.htm
Fig. 2. Photo showing the D/A adhesive as the grainy material between the die and the die pad
...
Die Attach (also known as Die Mount or Die Bond) is the process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package. There are two common die attach processes, i.e., adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and die attach tools to mount the die.


mk_lab
Ukraine
Local time: 10:40
Specializes in field
Native speaker of: Native in RussianRussian, Native in UkrainianUkrainian
PRO pts in category: 3719
Grading comment
Спасибо большое!
Notes to answerer
Asker: Спасибо большое!


Peer comments on this answer (and responses from the answerer)
agree  Michael Volia
16 hrs
  -> Спасибо
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