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20:10 Jul 21, 2019 |
English to Russian translations [PRO] Tech/Engineering - Electronics / Elect Eng / PCB, packaging | |||||||
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| Selected response from: mk_lab Ukraine Local time: 10:40 | ||||||
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3 +1 | материал в месте присоединения кристалла |
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d/a area material материал в месте присоединения кристалла Explanation: die attach area = место присоединения кристалла (к основанию корпуса) Особенности процесса сборки, Присоединение кристалла к ... https://studexpo.ru/67963/elektrotehnika/osobennosti_protses... Присоединение кристалла к основанию корпуса ... -------------------------------------------------- Note added at 53 mins (2019-07-21 21:04:29 GMT) -------------------------------------------------- Этот материал должен обладать высокой теплопроводностью https://www.multitran.com/m.exe?l1=1&l2=2&s=die attach area die attach area эл. место присоединения кристалла Die Attach Process https://eesemi.com/dieattach.htm Fig. 2. Photo showing the D/A adhesive as the grainy material between the die and the die pad ... Die Attach (also known as Die Mount or Die Bond) is the process of attaching the silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of the semiconductor package. There are two common die attach processes, i.e., adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and die attach tools to mount the die. |
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