English to Polish Tech/Engineering Electronics / Elect Eng integrated circuits

Forward bonds (first bond on the die, second bond on the substrate) should be made in the following order: 1.Gate.2. Bulk. 3. Center. 4. Drain. 5. Source.
While it is not critical that the bonds be made in this order, this order minimizes the number of substrate reorientations and prevents accidental damage to the bonds due to the bondhead.
dalej diabelne łączenia :(