Glossary entry (derived from question below)
English term or phrase:
clamping and pre-clamping region
Polish translation:
obszar przymocowania i obszar połączenia (pośredni, mostkowy)
Added to glossary by
Ewa Chojnowska
Apr 24, 2022 17:09
2 yrs ago
15 viewers *
English term
clamping and pre-clamping region
English to Polish
Tech/Engineering
Engineering (general)
spectrophotometry
Kontekst:
"The entire array is made up of microcantilevers connected to the chip through the pre-clamping region"
"In the case of the pre-clamping region, this type of modulation is not observed because the absorption of silicon does not allow multiple reflections inside a thicker structure"
" the next microcantilever has a first area that is thicker near the clamping region and a second area where its thickness is much less than the average thickness."
"The entire array is made up of microcantilevers connected to the chip through the pre-clamping region"
"In the case of the pre-clamping region, this type of modulation is not observed because the absorption of silicon does not allow multiple reflections inside a thicker structure"
" the next microcantilever has a first area that is thicker near the clamping region and a second area where its thickness is much less than the average thickness."
Proposed translations
(Polish)
3 | obszar przymocowania i obszar połączenia (pośredni, mostkowy) | Frank Szmulowicz, Ph. D. |
References
preclamp vs cantilever | geopiet |
Proposed translations
7 hrs
Selected
obszar przymocowania i obszar połączenia (pośredni, mostkowy)
The cantilever (the vibrating part) is "connected" (intermediate, bridging) to the chip via the thick pre-clamping region.
Clamping refers to the area that is fixed, hence not subject to vibrations - the area of direct attachment to the chip.
The entire array is made up of eight microcantilevers connected to the chip (400) through a 6 μm thick pre-clamping region (301) (see FIG. 4A).
https://patentimages.storage.googleapis.com/29/6e/9d/5064f23...
FIG. 4D shows a graph which shows the normalized reflectivity change as a function of the light emitter wavelength, obtained at three different positions along the microcantilever (near the clamped end of the microcantilever, at the middle and near the free end).
https://patentimages.storage.googleapis.com/29/6e/9d/5064f23...
Clamping refers to the area that is fixed, hence not subject to vibrations - the area of direct attachment to the chip.
The entire array is made up of eight microcantilevers connected to the chip (400) through a 6 μm thick pre-clamping region (301) (see FIG. 4A).
https://patentimages.storage.googleapis.com/29/6e/9d/5064f23...
FIG. 4D shows a graph which shows the normalized reflectivity change as a function of the light emitter wavelength, obtained at three different positions along the microcantilever (near the clamped end of the microcantilever, at the middle and near the free end).
https://patentimages.storage.googleapis.com/29/6e/9d/5064f23...
4 KudoZ points awarded for this answer.
Comment: "Bardzo dziękuję."
Reference comments
6 hrs
Reference:
preclamp vs cantilever
The array of cantilevers is comprised of eight cantilevers connected to the chip through a 6 µm thick pre-clamping region, as shown in the scanning electron microscope (SEM) images of Figure 2a,b (inset green box). - https://www.mdpi.com/1424-8220/16/6/926/htm
Figure 2a,b - https://www.mdpi.com/sensors/sensors-16-00926/article_deploy...
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