GLOSSARY ENTRY (DERIVED FROM QUESTION BELOW) | ||||||
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20:20 Sep 28, 2012 |
English to Italian translations [PRO] Law: Patents, Trademarks, Copyright / via | |||||||
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| Selected response from: tradu-grace Italy Local time: 03:34 | ||||||
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Summary of answers provided | ||||
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3 +4 | accesso verticale di interconnessione/intercollegamento |
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5 | por meio de |
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5 | tramite/ per mezzo di |
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4 | via |
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por meio de Explanation: via in english can mean by means of, through, ... Reference: http://www.thefreedictionary.com/via |
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tramite/ per mezzo di Explanation: Scusi non men'ero accorta che era italiano e non portoghese,, nonostante vale la stessa spiegazione e link sotto |
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via Explanation: sono dette vias (anche in italiano) le connessioni perpendicolari alla superficie di un chip, interconnects quelle orizzontali Reference: http://amsdottorato.cib.unibo.it/2965/ Reference: http://en.wikipedia.org/wiki/Via_%28electronics%29 |
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accesso verticale di interconnessione/intercollegamento Explanation: may be the following link can help you http://en.wikipedia.org/wiki/Via_(electronics) A via (Vertical Interconnect Access) is a vertical electrical connection between different layers of conductors in a physical electronic circuit. accesso verticale di interconnessione/intercollegamento -------------------------------------------------- Note added at 1 ora (2012-09-28 21:35:24 GMT) -------------------------------------------------- link correnction: http://en.wikipedia.org/wiki/Via_(electronics) -------------------------------------------------- Note added at 1 ora (2012-09-28 21:39:04 GMT) -------------------------------------------------- In IC In integrated circuit design, a via is a small opening in an insulating oxide layer that allows a conductive connection between different layers. A via on an integrated circuit is often called a through-chip via. A via connecting the lowest layer of metal to diffusion or poly is typically called a "contact". Often, redundant vias are added, where possible, to improve the reliability of the circuit and enhance the manufacturing yield. In PCB Different types of vias: (1) Through hole. (2) Blind via. (3) Buried via. In printed circuit board. It consists of two pads, in corresponding positions on different layers of the board, that are electrically connected by a hole through the board. The hole is made conductive by electroplating, or is lined with a tube or a rivet. High-density multi-layer PCBs may have microvias: blind vias are exposed only on one side of the board, while buried vias connect internal layers without being exposed on either surface. Thermal vias carry heat away from power devices and are typically used in arrays of about a dozen. A via consists of: 1. Barrel — conductive tube filling the drilled hole 2. Pad — connects each end of the barrel to the component, plane or trace 3. Antipad — clearance hole between barrel and no-connect metal layer -------------------------------------------------- Note added at 1 ora (2012-09-28 21:45:24 GMT) -------------------------------------------------- come suggerisce la collega potresti usare: vias come da testo allegato sotto Riferimento: http://amsdottorato.cib.unibo.it/2965/ -------------------------------------------------- Note added at 4 giorni (2012-10-03 10:23:43 GMT) Post-grading -------------------------------------------------- Grazie mille a te Livia. |
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